39#ifndef _3DICE_POWER_GRID_H_
40#define _3DICE_POWER_GRID_H_
58#include "stack_element_list.h"
188 StackElementList_t *list,
void power_grid_fill(PowerGrid_t *pgrid, ThermalGrid_t *tgrid, StackElementList_t *list, Dimensions_t *dimensions)
Error_t insert_power_values(PowerGrid_t *pgrid, PowersQueue_t *pvalues)
void update_channel_sources(PowerGrid_t *pgrid, Dimensions_t *dimensions)
Error_t power_grid_build(PowerGrid_t *pgrid, Dimensions_t *dimensions)
Error_t update_source_vector(PowerGrid_t *pgrid, Dimensions_t *dimensions)
void power_grid_init(PowerGrid_t *pgrid)
void power_grid_destroy(PowerGrid_t *pgrid)
Structure used to store data about the channel that compose the 2D/3D stack.
Collections of all the structures that are needed for the thermal simulation.
The floorplan representing the IC as a set of floorplan elements.
Structure used to store data about the heat dissipation through the top or bottom surfaces of the 2D/...
Structure used to store data about the power sources.
StackLayerType_t * LayersTypeProfile
HeatSink_t * BottomHeatSink
Floorplan_t ** FloorplansProfile
SolidTC_t * HeatSinkBottomTcs
Capacity_t * CellsCapacities
SolidTC_t * HeatSinkTopTcs
A First In - First Out circular queue to store power values.
Structure used to store data about the thermal cells / RC nodes.