3D-ICE 3.0.0
stack_description.h
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17 * Copyright (C) 2021 *
18 * Embedded Systems Laboratory - Ecole Polytechnique Federale de Lausanne *
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20 * *
21 * Authors: Arvind Sridhar Alessandro Vincenzi *
22 * Giseong Bak Martino Ruggiero *
23 * Thomas Brunschwiler Eder Zulian *
24 * Federico Terraneo Darong Huang *
25 * Luis Costero Marina Zapater *
26 * David Atienza *
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37 ******************************************************************************/
38
39#ifndef _3DICE_STACK_DESCRIPTION_H_
40#define _3DICE_STACK_DESCRIPTION_H_
41
44#ifdef __cplusplus
45extern "C"
46{
47#endif
48
49/******************************************************************************/
50
51#include <stdio.h> // For the file type FILE
52
53#include "types.h"
54#include "string_t.h"
55
56#include "channel.h"
57#include "heat_sink.h"
58#include "die_list.h"
59#include "layer_list.h"
60#include "dimensions.h"
61#include "material_list.h"
62#include "stack_element_list.h"
63
64/******************************************************************************/
65
72 {
76
79 MaterialList_t Materials ;
80
84
88
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95 LayerList_t Layers ;
96
99 DieList_t Dies ;
100
104
112 StackElementList_t StackElements ;
113 } ;
114
115
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121
122
123/******************************************************************************/
124
125
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157
158 (StackDescription_t *stkd, FILE *stream, String_t prefix) ;
159
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161
176
177 (StackDescription_t *stkd, String_t stack_element_id) ;
178
179
180
189
190 (StackDescription_t *stkd) ;
191
192/******************************************************************************/
193
194#ifdef __cplusplus
195}
196#endif
197
198#endif /* _3DICE_STACK_DESCRIPTION_H_ */
void stack_description_destroy(StackDescription_t *stkd)
Quantity_t get_number_of_floorplan_elements(StackDescription_t *stkd, String_t stack_element_id)
void stack_description_init(StackDescription_t *stkd)
void stack_description_print(StackDescription_t *stkd, FILE *stream, String_t prefix)
Quantity_t get_total_number_of_floorplan_elements(StackDescription_t *stkd)
char * String_t
Definition: string_t.h:55
Structure used to store data about the channel that compose the 2D/3D stack.
Definition: channel.h:71
Collections of all the structures that are needed for the thermal simulation.
Definition: dimensions.h:311
Structure used to store data about the heat dissipation through the top or bottom surfaces of the 2D/...
Definition: heat_sink.h:69
Structure containing all the informations related to the 3d stack.
MaterialList_t Materials
HeatSink_t * BottomHeatSink
Dimensions_t * Dimensions
StackElementList_t StackElements
HeatSink_t * TopHeatSink
uint32_t Quantity_t
Definition: types.h:59